Corroborating several previous reports that tipped Apple would be ditching the 3.5mm audio jack to make its next iPhone slimmer, a new report tips the iPhone 7 will be up to 1mm slimmer than its predecessor – but will retain the same design. The report adds the iPhone 7 will sport a dual-speaker setup, and a thinner cut-out for the Lightning port.

The upcoming iPhone 7 model will reportedly be 1mm thinner than the iPhone 6s, which already is 7.1mm thin, according to Macotakara. However, its metal build, height, width, and design profile will stay the same.

Apple will reportedly also eliminate the rear camera bump in the iPhone 7, making it flush with the device’s casing. The 3.5mm headphone jack will also be missing out as it might compromise of the smartphone’s thickness. As per previous reports, the Cupertino firm will be ditching the 3.5mm headphone port and instead will introduce a new set of Bluetooth headphones. Also mentioned was that the handset will include a dual-speaker setup, something that corroborates with the latest Macotakara report as well. Until now, the iPhone models features single mono speaker.

Lastly, it has been reported that to keep its slim profile the iPhone 7 will also be featuring a thinner Lightning port. This should not affect consumers, who will not require new cables and connectors, but the cut-out of the port will be slimmer, allowing for a reduction in size.

Previous reports indicate Apple would use EMI (electromagnetic interference) shield technology to major chips including RF (radio frequency), connectivity chips, AP (application processor), and modems which is expected to increase the iPhone’s performance while reducing electromagnetic interference experienced by chips.

The company is rumoured to gearing up for a new 4-inch iPhone, believed to be dubbed iPhone SE, and a new 9.7-inch iPad Pro at the same launch event on March 21.